Xpeedic, a chip-design software provider, launched EDA2027, adding a 3D integrated-circuit process design kit and photonic-electronic co-simulation.

Xpeedic introduced EDA2027 at its 2026 user-ecosystem conference in Shanghai on October 30. The conference focused on system-technology co-optimization, described in the report as chip-to-system collaborative optimization, and AI for electronic design automation, or EDA.

The release adds a three-dimensional integrated-circuit process design kit, or 3D IC PDK, and a photonic-electronic co-simulation platform. These are chip-design and simulation capabilities; the announcement does not describe a fabricated chip or deployed photonic computing system.

Xpeedic also introduced AgentEvo, an agentic AI platform, and XAI, its trusted physics-AI foundation. XAI here is Xpeedic’s product name, not the separate AI company xAI; the supplied report provides no benchmark, pricing, or customer-deployment figures for either platform.