TSMC is developing plans to manufacture 3D dynamic random-access memory at NVIDIA’s request; the initiative remains at the planning stage.

The reports describe manufacturing planning rather than production. FinancialJuice attributed the development to The Information, while a longer Financial_Express account cited two people familiar with the matter. They said TSMC had recently begun planning production of a specialized advanced-memory category called 3D dynamic random-access memory (DRAM), at NVIDIA’s request.

The reported background is memory-supply pressure. Financial_Express said rising AI hardware demand had contributed to severe memory shortages and higher prices, prompting companies including NVIDIA and Apple to seek additional sources. It also reported that Apple had raised prices on some products earlier in the year because of higher memory costs.

The available information does not establish a commercial manufacturing program. No fabrication location, process technology, wafer capacity, investment amount, production date, or contractual purchase volume is supplied. The sources identify 3D DRAM specifically and do not establish its packaging configuration or equivalence to a particular high-bandwidth-memory product.