Zhongwu High-tech approved ¥190 million for annual capacity of 140 million precision micro-tools serving high-speed AI printed circuit boards.

China Tungsten High-Tech (中钨高新; 000657.SZ), referred to in the digest as Zhongwu High-tech, approved an expansion by its controlled subsidiary Shenzhen Jinzhou Precision Technology. The project targets annual capacity of 140 million high-precision micro-tools for high-speed, high-frequency AI printed circuit boards (PCBs).

The estimated investment is ¥190 million. Funding consists of ¥178.5 million from Jinzhou’s own funds and ¥11.5 million in bank borrowing, and the investment was described as neither a related-party transaction nor a major asset restructuring.

The project will use leased factory space in the eastern section of the company’s Shenzhen base. Construction is scheduled for one year, with the project expected to reach designed capacity in its second year.

The company’s project calculation showed an after-tax financial internal rate of return of 14.55%. That figure is a project estimate rather than a realized operating return, and the source did not disclose customer commitments or contracted tool volumes.