Samsung described fabricating High Bandwidth Memory (HBM) base dies on a logic node to free package area for compute.

At Hot Chips 2026, Samsung discussed evolving the base die used in High Bandwidth Memory (HBM). The company described fabricating the HBM base die on a logic process node rather than treating it solely as a conventional memory component.

Samsung’s presentation linked that change to opportunities for freeing more package area for compute. The supplied reports did not provide a production date, named customer, process-node dimension or quantified package-area saving.

This was a packaging and memory-architecture presentation rather than the announcement of a shipping accelerator, server or complete computing system. It addressed how the HBM base die could evolve within packages serving machine-learning workloads that require increasing memory capacity and bandwidth.