Substrate maker Shennan Circuits can mass-produce flip-chip ball-grid-array substrates with 26 layers or fewer; 30-layer-plus products remain in development.

Shennan Circuits reported the manufacturing update during a recent institutional-investor discussion. According to the message, its Guangzhou production base continued releasing capacity and improving product-line capabilities during the third quarter of 2026.

The company said it has batch-production capability for flip-chip ball-grid-array (FC-BGA) packaging substrates with 26 layers or fewer. This is a substrate-manufacturing capability, not a count of semiconductor dies, processors, servers, or deployed compute systems.

Technology development and sample fabrication for substrates with 30 layers or more were progressing on schedule, while bismaleimide-triazine (BT) substrate capacity was also ramping. The source supplies no monthly output, yields, utilization rates, named customers, or commercialization date for the higher-layer products.