ComputeLabs Research
T-Head (平头哥) unveiled its Zhenwu V900 (真武 V900) chip and Panjiu AL64/AL144 (磐久 AL64/AL144) supernodes at Alibaba’s cloud conference.
· ComputeLabs Research · from the September 27, 2026 edition
A September 28 Telegram summary of a China Securities (中信建投) research report described Alibaba’s 2026 Apsara Conference (云栖大会) as presenting five layers of capability: chips, cloud, models, agents and applications. The report identified agentic AI as the conference’s organizing focus.
Within the hardware layer, T-Head (平头哥) presented chips spanning computing, storage and networking. The named announcements were the Zhenwu V900 (真武 V900) chip and the Panjiu AL64/AL144 (磐久 AL64/AL144) supernodes.
The chip and supernodes are different product levels and should not be counted interchangeably. The supplied summary provides no chip specifications, accelerator counts per supernode, power requirements, performance benchmarks or confirmed shipment volumes; the AL64 and AL144 names alone do not establish those quantities.
Additional reporting
- T-Head (平头哥)
- Zhenwu V900 (真武 V900)
- Panjiu AL64/AL144 (磐久 AL64/AL144)
- Alibaba