TSMC (台积电) reportedly plans five additional advanced-packaging factories in Chiayi (嘉义), with public consultation preceding feasibility and environmental assessments.

The expansion is reported rather than directly confirmed in the supplied material. The Telegram message relays media reporting attributed to unnamed supply-chain sources, describing five additional advanced-chip-packaging factories at Chiayi Science Park (嘉义科学园区). These are packaging facilities, not a disclosed addition of five wafer-fabrication plants.

The report distinguishes the proposed additions from five previously identified factories. P1 and P2 are expected to begin mass production in 2027, while P3, P4, and P5 are described as under construction in the park’s second phase. Completion of the five additional factories would bring the reported Chiayi packaging-factory total to ten.

The new expansion still has procedural stages ahead. The source describes a one-month public-comment period followed by feasibility studies and environmental assessments. It does not provide investment amounts, packaging throughput, specific packaging technologies, or commissioning dates for the additional five factories.