Semiconductor-technology provider Arteris expanded its multi-die portfolio to support transitions from monolithic chips to chiplet architectures.

Arteris announced an expansion of its multi-die semiconductor-technology portfolio. The stated purpose is to help chip designers move from monolithic system-on-chip (SoC) designs to chiplet-based architectures.

The announcement identifies AI, high-performance computing (HPC), and consumer electronics as target application areas. Its scope is semiconductor design technology, rather than the deployment of finished servers or cloud clusters.

The supplied excerpt does not identify individual new portfolio components or specify die counts, process nodes, or interconnect bandwidth. It also provides no quantified power, performance, area, or production-yield results.