Infineon and Skeleton Technologies partnered to combine CoolSiC power semiconductors with power-conversion systems for AI data centers.

Infineon and Skeleton Technologies announced a partnership focused on AI data-center power systems. The collaboration is expected to combine Infineon’s CoolSiC power semiconductors with Skeleton’s power-conversion expertise.

CoolSiC refers to Infineon’s silicon-carbide power-semiconductor portfolio. The partnership concerns power conversion rather than compute accelerators, servers or data-center capacity.

The supplied source does not provide a contract value, customer, deployment capacity or implementation date. It describes a technology partnership rather than a completed data-center installation.