University of Michigan-Dearborn optimized liquid-cooling channels for a 2.7-kilowatt package containing two GPUs and one CPU.

University of Michigan-Dearborn researchers published a technical paper on generative design of liquid-cooling channels for 2.5-dimensional and 3-dimensional integrated advanced packages. The work uses a physics-guided generative-design framework for cooling-channel topology optimization.

The evaluated package has a total thermal load of 2.7 kilowatts and contains two high-power graphics processing units and one central processing unit. The 2.7-kilowatt figure applies to the complete multi-chip package rather than to each individual processor.

The research focuses on liquid-cooling channel geometry within advanced packaging. The supplied abstract does not disclose commercial availability, coolant type, flow rate, inlet temperature, pressure drop, final device temperatures, or deployment in a production server.