TCL CSOT plans to enter optical communications through indium-phosphide laser chips, later evaluating optical components and high-speed modules.

TCL CSOT (TCL华星) Chief Executive Officer Zhao Jun said at a TCL Technology investor meeting that the company plans to enter optical communications through the Shenzhen Huazhaoxingguang project. He linked the initiative to the expansion of artificial-intelligence data centers and divided the business plan into three stages.

The first stage will focus on indium-phosphide laser chips and establishing core technology and scaled manufacturing capability. TCL CSOT plans to reuse capabilities from its existing light-emitting-diode business, including factory design, chip manufacturing, facility systems, and its industrial cluster.

After laser-chip production matures, the second stage would extend into transmitter optical subassemblies and receiver optical subassemblies, commonly abbreviated as TOSA and ROSA. In the third stage, TCL CSOT would evaluate expansion into high-speed optical modules according to customer and market demand, making that module expansion an evaluation step rather than a disclosed operating deployment.