Samsung has sold all 2027 high-bandwidth memory (HBM) capacity and is rapidly increasing HBM4 deliveries.

The supplied Samsung recap states that its entire 2027 high-bandwidth memory (HBM) capacity was sold out and that HBM4 deliveries were increasing rapidly. The sold-out statement concerns next year’s capacity commitments, not memory already manufactured and delivered.

Samsung had signed multiyear long-term supply agreements with 10 major customers and was in final-stage negotiations with another 10. The report says the agreements’ application scope had expanded beyond cloud service providers into mobile, automotive, and networking markets; it does not identify every agreement as HBM-specific.

Samsung attributed continuing memory-demand strength to AI ecosystem expansion. It also forecast shortages extending into 2028 or longer, citing larger dies, additional metal layers in HBM4E/HBM5, and supply-chain limitations; that duration is a company outlook, not a verified future supply outcome.

The source does not quantify sold HBM capacity in units, wafers, or memory volume, nor does it disclose customer allocations or contract pricing. Similarly, “rapidly increasing” HBM4 deliveries is not accompanied by a shipment growth rate.