🇺🇸Broadcom (博通) entered early-stage talks for over $50 billion in financing for OpenAI custom AI chips; financing remains unclosed.

The financing remains at the discussion stage. Financial_Express, citing The Wall Street Journal and unnamed sources, reported that Broadcom had spent recent weeks arranging more than $50 billion for its custom-chip collaboration with OpenAI. Apollo and Blackstone were among the institutions discussing participation, and the financing amount remained subject to change.

The report identifies the underlying chip-development program. OpenAI internally calls the project “Nexus,” with the first and second chip generations code-named Jalapeño and Serrano. The same report references an earlier announcement covering 10 gigawatts of custom-chip systems, with planned deployment from the second half of 2026 through the end of 2029; this is a system-deployment figure, not a chip count or semiconductor-factory production rate.

The proposed funding is not equivalent to financed or deployed capacity. The report described potential coverage of several gigawatts and possible completion as early as year-end, but neither was a closed outcome. It supplied no final interest rate, collateral package, borrowing entity, or drawdown conditions.