Wuhan Xinxin targets quadrupling specialty-wafer and three-dimensional-integration capacity under its 10-year Chip Light Plan (芯光计划).

Wuhan Xinxin Semiconductor Manufacturing announced its 10-year Chip Light Plan (芯光计划) at a company development conference in Wuhan’s Optics Valley. General manager Sun Peng presented the program on August 28.

The plan uses “optical sensing and interconnection” and “three-dimensional storage and computing” as its strategic themes. Wuhan Xinxin intends to build a specialty-process wafer-manufacturing and three-dimensional-integration industrial platform centered on “3D Link–optoelectronic integration–silicon on insulator.”

The company is targeting a fourfold increase in capacity over the plan’s 10-year period. It also aims to support an upstream and downstream industrial ecosystem exceeding RMB100 billion and attract or develop more than 10,000 high-end semiconductor professionals; these figures are corporate targets, not completed results.