🇺🇸Broadcom is discussing $60–70 billion in senior secured debt, potentially plus $30 billion in junior debt, for AI chips.

Broadcom is reportedly negotiating with lenders over an AI-chip financing structure that remains under development. Under the proposal, a special-purpose vehicle would issue between $60 billion and $70 billion of senior secured debt, with Broadcom discussing a guarantee for part of that tranche.

The structure may also include approximately $30 billion of junior debt, bringing the total financing under discussion to as much as $100 billion. These figures describe a potential facility rather than completed or funded financing.

Blackstone and Apollo Global Management were reported to be in talks with Broadcom about participating. The companies had previously entered an “AI XPV platform” partnership in June involving $35 billion of financing for 1 gigawatt of Broadcom custom-chip infrastructure to be built and operated by Fluidstack, with the resulting compute purchased and used by Anthropic.