Microsoft plans a September unveiling of the Maia 300 AI accelerator and seeks TSMC capacity exceeding 300,000 chips for 2027.

Microsoft plans to unveil its next-generation Maia 300 internally developed AI accelerator as early as September, according to reporting attributed to The Information. The report described the effort as recovering after a slow start.

Microsoft has been discussing manufacturing capacity with Taiwan Semiconductor Manufacturing Company, or TSMC, for more than 300,000 Maia chips to be delivered during 2027. The sources describe capacity discussions rather than confirmed production or delivery of that quantity.

Microsoft reportedly believes Maia can run both its internally developed models and OpenAI models at lower cost. No price, process node, power rating, memory configuration, performance benchmark, or final TSMC supply commitment was provided in the supplied reports.

The planned September event is an unveiling, not a stated general-availability date. Similarly, the 300,000-plus figure refers to requested manufacturing capacity for 2027 rather than chips already fabricated or installed.