Samsung’s Asan high-bandwidth memory (HBM) packaging investment totals KRW 6 trillion, with approximately KRW 40 trillion in equipment investment planned.

South Korean President Lee Jae-myung said Samsung is investing KRW 6 trillion in a high-bandwidth memory packaging plant in Asan, South Korea. The stated facility scope is HBM packaging, not a disclosed GPU production plant or data-center project.

Lee said approximately KRW 40 trillion in advanced-equipment investment would follow. The source presents that equipment spending as a subsequent investment plan, not expenditure already completed.

The two figures describe separate stated investment components and should retain their respective scopes. The supplied messages provide no construction completion date, equipment installation schedule, HBM generation, packaging throughput, or customer allocation, and they are not Samsung capital-expenditure filings.