Display manufacturer BOE produced and sampled 24-layer glass packaging substrates exceeding 100 × 100 millimeters; customer samples passed relevant reliability tests.

BOE discussed its glass packaging-substrate progress during November 5 meetings with J.P. Morgan and China Merchants Fund, according to Financial_Express. Here, BOE refers to the display manufacturer, not the Bank of England.

The company said it had connected the full manufacturing process, including high-aspect-ratio through-glass via (TGV) formation, deep-hole copper filling, low-stress metal routing, high-layer-count lamination, high-density routing, and low-stress cutting. BOE described this as a complete glass packaging-substrate manufacturing capability.

Its experimental line had achieved operation across fully automated equipment, with 24-layer substrates in an 11-2-11 configuration exceeding 100 × 100 millimeters produced and sent for sampling. Customer samples had passed relevant reliability tests, but the report supplies no test standards, production yields, commercial order quantities, or mass-production schedule.