Micron has no plans to adopt 4F² memory technology, continuing its 6F² approach and next-generation 3D dynamic random-access memory development.

According to Telegram reports citing Nikkei, Micron Chief Technology and Products Officer Scott DeBoer said the company had evaluated 4F² memory technology for more than 20 years. He said Micron currently had no plans to adopt it.

Micron instead intends to continue with its 6F² structure and next-generation three-dimensional dynamic random-access memory, or 3D DRAM. The statements describe a technology-development direction, not a new product launch or the start of volume production.

DeBoer characterized 4F² technology as more complex and costly, with limited practical advantages, while expressing greater confidence in 3D DRAM’s potential. These are attributed technical assessments; the supplied reports contain no comparative cost figures, yield data, or production timetable.