Custom-chip designer Alchip will showcase 3nm production, 2nm design, and multi-die packaging capabilities at the September 15–17 AI Infra Summit.

Alchip Technologies announced plans to showcase its process-technology and advanced-packaging achievements at AI Infra Summit 2026. The event runs September 15–17 at the Santa Clara Convention Center, with Alchip exhibiting at Booth 1705.

The announcement distinguishes 3nm production capabilities from 2nm design capabilities. It does not describe 2nm production as already underway, and those two stages should not be treated as equivalent manufacturing milestones.

The presentation also covers application-specific integrated circuit (ASIC) design, three-dimensional integrated circuit (3DIC) capabilities, and multi-die advanced packaging. The supplied excerpt names no customer designs, production volumes, yields, package specifications, or new commercial contracts.