Xiaomi (小米) commercialized its Xring O3 (玄戒O3) smartphone processor; cumulative investment in chip development reached RMB 21 billion.

Xiaomi (小米) said Xring O3 (玄戒O3) had entered mass-production commercialization with the launch of two Xring-equipped devices. At its September 7 autumn flagship event, founder, chairman, and chief executive Lei Jun (雷军) stated that cumulative chip-development investment had reached RMB21 billion, against a previously outlined RMB50 billion, ten-year research-and-development plan.

The Xiaomi 18 Fold combines the company’s Xring O3 processor, HyperOS 4 (澎湃OS 4), and MiMo on-device model. The launch report describes it as the first device to bring together Xiaomi’s internally developed chip, AI, and operating-system technologies, following more than 20 months of project development.

The handset starts at RMB10,999 and includes a 6,000-milliampere-hour Jinshajiang battery (金沙江电池), a stated single-side thickness of 5.02 millimeters, a weight of 219 grams, and support for up to six split-screen panes. A silicon-nitride ceramic special edition offers 16GB memory and 1TB storage for RMB15,999, with production limited to 1,500 units.

Lei also said Xring O100 (玄戒O100) and Xring D100 (玄戒D100) were planned for commercialization in the first half of 2027. Those are management’s future product plans, distinct from O3’s reported commercial status; the sources describe Xiaomi’s broader work across smartphone SoCs, AI accelerators, and intelligent-driving chips without providing detailed specifications for the two forthcoming products.