SEMI expects glass substrates to enter limited production around 2028, supporting approximately tenfold higher interconnect density.

A research report cited SEMI as expecting glass substrates to enter limited production around 2028. The forecast concerns semiconductor packaging substrates, not conventional display glass or complete semiconductor devices.

Compared with organic packaging substrates, glass substrates were described as offering extremely low warpage and stronger thermal and mechanical stability. These characteristics support larger package dimensions as compute chips move toward larger and more highly integrated designs.

The report said glass could improve wiring design rules by approximately one order of magnitude, corresponding to roughly ten times the interconnect density. It linked that density improvement to placing and connecting more transistors within a single package.

SEMI’s cited forecast estimated a compound annual growth rate of approximately 67.2% for the market from 2028 through 2040. The corresponding market size was projected at approximately $13 billion in 2040, but these figures remain forecasts rather than current production or revenue.