TCL Technology targets a 12-layer glass-substrate sample this half, versus 20 layers for mainstream high-performance packaging.

TCL Technology (TCL科技; 000100) said during an institutional-investor survey that mainstream glass-based advanced packaging for high-compute and high-performance chips requires approximately 20 layers. The company’s planned sample for the second half of 2026 is expected to have approximately 12 layers.

TCL said it is relying on external resources to establish the technical route and prepare a complete sample. It attributed the lower layer count to technical limitations associated with those external resources and acknowledged that the planned sample remains short of the 20-layer mainstream level it cited.

The company stated that it would initiate construction of a pilot line during 2026 if the sample performs as expected and the technical route is substantially established. That makes the pilot-line construction conditional on sample and process validation rather than an already completed or unconditional deployment.

The disclosure concerns a glass-substrate packaging sample, not a finished AI accelerator, server or production-scale packaging line. No pilot-line investment amount, production capacity, customer commitment or mass-production date was disclosed.