SK hynix broke ground on a more than $4 billion advanced-packaging plant in Indiana, targeting next-generation High Bandwidth Memory (HBM) production in the second half of 2029.

SK hynix held a groundbreaking ceremony on August 27 for an AI-memory advanced-packaging facility in West Lafayette, Indiana. The project’s total investment is expected to exceed $4 billion.

The company expects cleanroom construction to be completed in October 2028. Mass production of next-generation High Bandwidth Memory, or HBM, is scheduled to begin in the second half of 2029.

SK hynix also signed a memorandum of understanding with Purdue University covering advanced-packaging research and development. The planned cooperation includes next-generation system integration and packaging technologies involving HBM.

The ceremony took place at Purdue University. The disclosed project concerns advanced packaging and HBM production rather than a general-purpose logic-chip fabrication plant.