Dier Laser’s through-glass-via equipment continued generating orders and revenue; laser-modification and etching systems received bundled orders.

Dier Laser (帝尔激光) said its laser-modification equipment for through-glass vias (TGVs) continued to receive orders and generate revenue. It also reported that customers had begun placing bundled orders covering both laser-modification and etching equipment.

The company is additionally developing etching and automated optical inspection (AOI) equipment around its TGV product line. AOI equipment remained in active customer validation, while the laser-modification and etching systems had progressed to bundled orders.

Dier Laser said its TGV equipment covers both wafer-level and panel-level applications, and some glass-substrate customers had placed repeat orders. It identified current applications including glass-substrate vias for advanced packaging, fiber-array units, and passive glass components for optical communications.

The company described TGV and related applications as still being in the industrial-introduction stage. It said remaining glass-substrate production difficulties were concentrated more in downstream metallization, film and material-combination yields, and microcracking than in its laser-modification process, which it said met customers’ yield and technical requirements.