Coherent began customer sampling of 300-millimeter high-thermal-conductivity silicon carbide substrates for AI semiconductor thermal-management applications.

Coherent began sampling 300-millimeter high-thermal-conductivity silicon carbide, or SiC, substrates to leading AI-semiconductor partners. The announced stage is customer sampling rather than confirmed high-volume production or completed customer qualification.

The substrates are intended to address thermal-management requirements in artificial intelligence and high-performance computing semiconductor applications. Coherent characterized the development as an expansion of its scalable materials platform.

The 300-millimeter figure refers to substrate diameter, not semiconductor process-node size or data-center capacity. The source does not disclose customer names, thermal-conductivity measurements, wafer pricing, production capacity, qualification schedules, or commercial shipment dates.