Samsung unveiled zHBM, a 3D-packaged high-bandwidth memory (HBM) design, plus two NAND offerings for solid-state drives.

Samsung introduced zHBM at the Future of Memory and Storage Summit. The product was presented as a new form of high-bandwidth memory using three-dimensional packaging.

The announcement addressed what the source calls the AI “memory wall,” described as a major bottleneck for AI inference workloads. The product is a memory design, not a graphics processing unit or standalone AI accelerator.

Samsung also unveiled two NAND-flash offerings intended for solid-state drives. The supplied article summary does not provide their model names, capacities, interface speeds or availability dates.